1 x HEAT SINK BGA/PGA 16.5X16.5X8.9

Height Off Base (Height of Fin): 0.350" (8.89mm). HEAT SINK BGA/PGA 16.5X16.5X8.9. Power Dissipation @ Temperature Rise: -. Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM. Shape: Square, Fins.

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