GEL-Flux Liquid Soldering 100 cm3 / PCB No-Clean Ag, Cu, Au, Zn, Cd and SnPb
Good solderability on surfaces: Ag, Cu, Au, Zn, Cd, and SnPb. Gel flux is a thickened rosin flux of the RMA class designed for SMT assembly and repairs. Flux is intended to extend the lifespan of electronic devices.