Specification Heating: IR Upper Heating Consumption: 400W Bottom Heating Consumption: 800W General Power: 1250W Upper Control Mode: Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm. Bottom Control Mode: Independent temperature control, high-precision closed-loop control, precision ± 0.5%, No Alarm. SMD: Suit for welding, removing, or repairing package devices, such as BGA, PBGA, CSP, multi-layer substrates, EMI metallic shield products, solder / lead-free rework, and welding. Upper Heating Size: 80*80 mm Bottom Heating Size: 180*180mm Applicable Chip Size: ≤70*70 mm Applicable PCB Size: ≤400*305 mm Power: 110V Package 1* BGA Rework Station 1* Power Cord 1* Sensor Wire 1 Roll* Tinfoil 1* USB Cable 1* English Manual.
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