No-Clean Lead-Free Low Temperature Thermally Stable Solder Paste Jar T4 Mesh 50g

No-clean, lead-free, low temperature thermally stable solder paste in 50g jar. Dispense grade. Flux Type Synthetic No Clean. Solder Alloy 42, 57.6, 0.4 Sn, Bi, Ag. Clear residue. Compatible with enclosed print heads.

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