No-Clean Lead-Free Thermally Stable Solder Paste Jar T4 Mesh 50g

No-clean, lead-free, thermally stable solder paste in 50g jar. Dispense grade. Flux Type Synthetic No Clean. Solder Alloy 96.5, 3, 0.5 Sn, Ag, Cu. Clear residue. Compatible with enclosed print heads.

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