1 x HEATSINK BGA W/O SOLDER ANCHORS

Height Off Base (Height of Fin): 0.709" (18.00mm). Material: Aluminum. Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM. Thermal Resistance @ Natural: 15.30°C/W. Power Dissipation @ Temperature Rise: 3.0W @ 50°C.

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