Thermal Conductive Paste Processor CPU VGA Heatsink 1g Computer Card

Syringe thermaloconductive pasta 1 gr High -performance thermal pasta to maximize heat transfer from the heatsink processor. The high viscosity formula effectively fills the invisible imperfections of the surface, improving the contact and thermal conductivity. Thermal resistance: <0.201 ° C-in ² / W Syrinx Design, for Easy Operation. High conductivity, Low Bleed, stable at high temperatures. Type: Silicone Fluid with 20% Metal Oxide. Dielectric Breakdown:> 5.0 kV ac. Non-Taxic, Tasteless, non-Corrosive. Discounts in case of multiple purchases, considerable savings !!! Priority mail (not traceable, delivery in 2 - 3 working days) Registered mail (safe and traceable, delivery in 4 - 5 working days) Registered mail 1 (safe and traceable, delivery in 24 hours) Express courier (safe and trace.

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