JCID UF6008 Chip Underfill Adhesive 5ml for Mobile Phones Nand CPU Packaging BGA
The JCID UF6008 is a versatile product that caters to a wide range of electronic repair scenarios. The JCID UF6008 is not just about performance; it's also designed with the user in mind. 1x OJCID UF6008 Chip Underfill Adhesive 5ml.