Breadboard 830 Pin Solderless Prototyping Bread Board Great for Development

Specifications: Dimensions: 165mm x 55mm x 9mm Total Tie/Connection Points: 830 Rows: 63 rows on both sides Tie Points per Row: 5 Power Rails: 4 (dual power rails) Hole Pitch: 0.1 inch (2.54mm) Features: Ample Space: Provides 830 tie points, suitable for creating and testing various circuit designs. Flexibility: 63 rows with 5 tie points each, offering flexibility in component connections. Power Rails: Dual power rails for easy access to power sources. Standard Compatibility: 0.1-inch hole pitch compatible with standard electronic components. Applications: Ideal for hobbyists, students, and profess.

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