Heatsink Thermal Grease Paste Compound CPU Cooler Adhesive Glue Silicone H1D3

1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.

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