Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1489983244, ISBN-13 9781489983244, Like New Used, Free P&P in the UK RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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