Now, the first product lines are completed, which are also the highest demands of the manufacturer and the overclocking community justice. The choice of thickness should depend only on the gap to be bridged here so.
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Specifications GP Thermal Pad 1mm GP Thermal Pad 0.5mm. Thermal Conductivity (W/mK) 12. Pad size (mm) 80 x 40. Available in two thicknesses. During that process you will be issued with an RMA number.
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The GP-Ultimate 120×20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.
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Heatsink Material:Silicone. 100/200/500 pcs 10mm 10mm 1mm pads. Silicone pad Size:10mm 10mm 1mm. Thermal Conductivity: 1.2W~2.0W. Compatible CPU:CPU. Hardness: 13C ~ 50C.
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Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 15 × Thickness 0.5mm Silicone Thermal Pad.
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Dielectric Constant 50mm 50mm 5cm SQ. 0.5mm 1mm THICK BLUE 2 w/m-k. THERMAL ADHESIVE HEAT SINK PAD. Thermal Heat-sink Insulation. Thermal Conductivity 30 Shore C. > 3.1 10″Ω.cm. 5.5℃-in2/W.
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Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 200 × Thickness 0.5mm Silicone Thermal Pad.
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Available in a variety of different sizes and thicknesses. Thermal Conductivity : ★★★★. within the capabilities of Thermal Pads. High thermal conductivity. Thermal Conductivity The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide.
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