Heat Sink Material: Aluminium. High power extruded heat sink with large radial fins and straight pins. During that process you will be issued with an RMA number. External Height - Imperial: 2.5". Images shown are for demonstration purposes.
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A compact, extruded clip-on heat sink suitable for use with TO-218 or TO-247 type components. Images shown are for demonstration purposes.
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Heat Sink Material: Aluminium. High power extruded heat sink with large radial fins and straight pins. During that process you will be issued with an RMA number. External Height - Imperial: 2.5". Images shown are for demonstration purposes.
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The HF35G is a 27.94 x 20 x 36mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation.
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Heatsink, BGA, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil. BGA Heatsink, Tape mounting. A range of BGA heatsinks with thermally conductive adhesive tape mounting. BGA Heatsinks. For Use With BGA. Dielectric Strength 8kV/mm.
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The 5F is a 12.7mm board level Heat Sink made of aluminium, mounted by self-tapping screw in flank. This PCB mount heat sink is suitable for use with TO-5 device. Heat Sink Material: Aluminium. During that process you will be issued with an RMA number.
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The HF20 is a 27.94 x 20 x 21mm versatile and powerful extruded Heat Sink with integral spring clip and solderable tabs. This heat sink is made of aluminium with black anodize finish and features vertical mount orientation.
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