This also makes it suitable for dual-socket motherboards. To adjust the airflow direction if required, the fans can be easily swapped over. It also supports the Ampere Altra LGA4926 . Designed for static pressure, the fans are ideal for the Freezer 4U-M Rev. 2's high fin density and provide efficient heat dissipation in push-pull mode, even in power-hungry applications.
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It also supports the Ampere Altra LGA4926 . AMD: SP6, sTR5, SP3, TR4, sTRX4, sWRX8. This also makes it suitable for dual-socket motherboards. To adjust the airflow direction if required, the fans can be easily swapped over.
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Thermal Conductivity: >3.17W/m. k,Thermal Resistance: <0.067°c-in2/w. Compatibility varies due to variations in the cars modlue or availabilty of year it released from original factory. your kind understanding would be highly appreciated!
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new unused thermal paste
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Manufacturer: ARCTIC. Shape: Thermal Paste. 100 % ORIGINAL THROUGH AUTHENTICITY CHECK: Through our Authenticity Check, it is possible to verify the authenticity of every single product. EASY TO APPLY: With an ideal consistency, the MX-4 is very easy to use, even for beginners.
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Enhance your computer's performance with the ARCTIC MX-4 Thermal Paste, known for its excellent thermal conductivity. This grey compound is ideally suited for a wide range of applications, ensuring your system maintains optimal operating temperatures. The high-quality formulation of the ARCTIC MX-4 Paste provides superior heat transfer, which is crucial for the longevity and efficiency of your CPU and GPU. With its easy application and durable nature, it's an essential for any computer enthusiast looking to push their hardware to its fullest potential.
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Thermal Conductivity: >3.17W/m. k,Thermal Resistance: <0.067°c-in2/w. Operation Temperature: -50/280°c. Weight: 6.0g/tube. Compatibility varies due to variations in the cars modlue or availabilty of year it released from original factory.
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Thermal Paste, 15g Upgrade Easy to Apply Thermal Paste Cpu Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance, Thermal Interface Material. It can improve that heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking.
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