Sold as individual 6.5" long solder stick or a tube of 9 sticks. Alloy Chip Quik®. Flux type: No Clean.
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Easily remove SMD parts with Chip Quik® removal alloy.
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Low viscosity low temperature no-clean synthetic paste flux. Has a pleasant odor. Do not freeze. Flux Type: Synthetic No-Clean (for Low Temperature Leaded and Lead-Free applications). Flux Classification: REL0.
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Safely removes SMDs using low heat. Fast and easy to use. Heat can be applied with a soldering iron, warm air preheater or heat gun. The SMD is easily removed with the tweezers or a pickup tool. The kit removes 8-10 SMDs.
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It contains no lead and is therefore RoHS compliant. It does not contain flux. Bismuth solder joints are more brittle than most common electrical solders so should not be used in applications which may be subject to shock/impact.
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SMD Removal (With solder iron or warm air bath) • Apply flux to all leads. • Melt CHIP QUIK® uniformly on all pins. • Maintain alloy in molten state long enough to release chip. • Lift chip from board with dental pick or vacuum pen. CLEAN UP While molten, use cotton swab and flux to move excess to an unused section of board. • While applying heat, polish each pad with a swab and flux until thoroughly clean. At room temperature, clean residue with alcohol pad. • You are now ready to install the new chip. 2.5 ft of Chip Quik® material, removes 1250 to 1500 SMD pins. Conforms to the following Industry Standards: J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): RoHS 2 Directive 2011/65/EU: Yes Yes
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TheCHIP QUIK No-Clean Solder Paste Syringe (5cc) is an essential tool for precision soldering applications. Solder Alloy: 63, 37 Sn, Pb. Suitable for both professional and hobbyist use, this solder paste ensures precision and durability in electronic assembly.
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