No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip. Dispense grade. Solder Alloy 42, 57.6, 0.4 Sn, Bi, Ag. Flux Type Synthetic No Clean. Clear residue. Low voiding.
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No-clean, lead-free solder paste in syringe applicator with plunger and tip. Dispense grade. Solder Alloy 96.5, 3, 0.5 Sn, Ag, Cu. Passes BONO test at 1.56%. Flux Type Synthetic No Clean. Compatible with enclosed print heads.
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Chip Quik SMD Removal Alloy PB 12m SMD4.5 NL. Manufacturer part number: SMD4.5NL. Lead-Free / RoHS 3 Compliant / REACH Compliant Chip Quik Alloy for SMD Removal (4.5ft. In 9-6.5in. Lengths) Lead-Free.
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No-clean tack flux is non-corrosive and non-conductive. Suitable for all rework solder and desolder applications. Flux Type No Clean. Flux Applications Soldering. Soldering flip chip components. Will not run all over PCB when applied.
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TheCHIP QUIK No-Clean Lead-Free Solder Paste Syringe is a thermally stable, low-temperature solder paste designed for precision applications. Weight: 15g per syringe. Dispense grade for precision application.
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TheCHIP QUIK No-Clean Liquid Flux Refill Bottle provides a high-performance, water-based flux solution designed for seamless soldering and de-soldering applications. Ideal for all types of soldering and de-soldering tasks, this flux is widely used in electronics repair, prototyping, and PCB assembly.
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No-clean, lead-free, low temperature thermally stable solder paste in 50g jar. Dispense grade. Flux Type Synthetic No Clean. Solder Alloy 42, 57.6, 0.4 Sn, Bi, Ag. Clear residue. Compatible with enclosed print heads.
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No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip. Dispense grade. Solder Alloy 42, 57.6, 0.4 Sn, Bi, Ag. Flux Type Synthetic No Clean. Clear residue.
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