The GP-Ultimate 120×120 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCBs with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.
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Gelid Solutions GP Ultimate 0.5mm Thick Thermal Pad (90 x 50 x 0.5 mm) W/mK 15. Gelid Solutions GP Ultimate 1mm Thick Thermal Pad (90 x 50 x 1.0 mm) W/mK 15. GP Thermal Pad 0.5mm. GP Thermal Pad 1mm. Thermal Conductivity (W/mK).
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The Thermal Pad APT2012 is the ideal, budget-friendly choice for situations that require thermal transmission without needing particularly high performance. ARCTIC thermal pads are non-adhesive and can be precisely positioned.
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Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. 100/200/500 pcs 10mm 10mm 1mm pads. and best wishes!
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Founder computer and all laptop and computer heatsink solution. The copper has high purity,coefficient of thermal conductivity as high as 401w/mk. High conductivity thermal adhesive tape. I send goods within 12 hours.
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Available in a variety of different sizes and thicknesses. High thermal conductivity. Thermal Conductivity Protective film coating (remove prior to installation). These pads are of the highest quality to ensure a constant, optimal heat transfer.
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The Thermal Pad APT2012 is the ideal, budget-friendly choice for situations that require thermal transmission without needing particularly high performance. ARCTIC thermal pads are non-adhesive and can be precisely positioned.
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Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. Heatsink Material:Silicone. 100 pcs 10mm 10mm 1mm pads. Hardness: 13C ~ 50C.
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