Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. hope you could understand.
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Thermalright ODYSSEY Thermal Pad 3.0 x 85x45mm 12.8 W/mK Non Conductive CPU GPU. ✔️ 1 × Thermalright ODYSSEY Thermal Pad 3.0 × 85×45 mm 12.8 W/mK Non-Conductive CPU GPU. TheThermalright ODYSSEY Thermal Pad is a professional-grade silicone heat interface designed for outstanding thermal transfer with complete electrical insulation.
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1、 Good thermal conductivity, insulation, viscosity, elasticity, low heat resistance, filling. 5、 The pad has viscosity, simple and convenient application, stable heat conduction, insulation and softness and flexibility.
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2 x Gelid Solutions GP Ultimate 3mm Thick Thermal Pads 90 x 50 x 3.0 mm W/mK 15. 2 x Gelid Solutions GP Ultimate 1mm Thick Thermal Pads 90 x 50 x 1.0 mm W/mK 15. 2 x Gelid Solutions GP Ultimate 1.5mm Thermal Pads 90 x 50 x 1.5 mm W/mK 15.
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The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm.
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The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm.
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Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. 100 pcs 10mm 10mm 1mm pads. Hardness: 13C ~ 50C.
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Thermalright ODYSSEY Thermal Pad 0.5 x 85x45mm 12.8 W/mK Non Conductive CPU GPU. ✔️ 1 × Thermalright ODYSSEY Thermal Pad 0.5 × 85×45 mm 12.8 W/mK Non-Conductive CPU GPU. TheThermalright ODYSSEY Thermal Pad is a professional-grade heat interface material designed to provide exceptional thermal conductivity and electrical insulation.
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