Features: Achieve optimal heat dissipation with exceptional 128W/m'K conductivity. Perfect for gaming and intensive tasks. Unleash the full potential of your devices with an upgraded cooling solution.
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Application range: CPU heat sink, GPU, LCD, LED, electronic products. Low thermal resistance;. Squeeze the soybean size and apply it to the center of the CPU surface. Thermal conductivity: 14.3W/m-K.
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Net content: 5g / 10g (optional). Application range: CPU heat sink, GPU, LCD, LED, electronic products. Low thermal resistance;. Squeeze the soybean size and apply it to the center of the CPU surface.
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Net content: 5g / 10g (optional). Application range: CPU heat sink, GPU, LCD, LED, electronic products. Squeeze the soybean size and apply it to the center of the CPU surface. Use a spatula to apply thermal grease on the CPU.
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Net content: 5g / 10g (optional). Application range: CPU heat sink, GPU, LCD, LED, electronic products. Squeeze the soybean size and apply it to the center of the CPU surface. Use a spatula to apply thermal grease on the CPU.
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5G Tube - Professional & high -quality thermal paste from Donau Elektronik - Suitable for processors, graphics cards, coolers, etc. - is used wherever heat is to be derived! Non -toxic and environmentally friendly! Provides a similarly low thermal resistance such as silicone -containing thermal pastes and the problems of silicone -containing thermal paste, such as contaminants and evaporations and their precipitation are avoided When installing performance haulders on cooling elements, it is time -functioning to use electrically non -conductive thermal paste. This gives a faster heat exchange between the metal parts. at that in your name or is created according to your information. If you would like a delivery or billing address that deviates from Ebay, please let us know or change it in.
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High thermal conductivity, increased indium content, Easy application with synthetic needle. Thermal conductivity: 73W/mK. Shape: liquid. Color: silver. Applications: CPU, GPU,Notebook computer, IC.
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Thermal paste with gold powder ≥2.8W/MK AG Gold 3G AGT-123 The product is ideal for all processors, chipsets and for other heat -intensive high -performance systems. AG Gold is a qualitative thermal paste. Due to a very high proportion of gold, which is even 45 %, their thermal conductivity is 3 times better than in the case of the usual thermal paste. The paste has the CPU temperature reduced by 6 degrees, even without exchanging fans. The paste forms the best option for the overclockers. Fills out microfanities between the connecting elements, e.g. processor and heat sink, Perfect as a heat conductor from the condenser of the heat ear to the heat exchanger in a vacuum solar collector. Manufacturer: AG Termopasty Thermal conductivity f/mk> 2.8 Thermal impedance ° C in2/w <0.095 Work tempe.
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