【Excellent Performance】Excellent performance origins from its outstanding data, the thermal conductivity is (up to) 14W/M.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
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You can follow below process to chontact us. All pictures are for illustration purpose only and Colours may vary slightly. Import Duties. avviso caldo:tenere i bambini lontano da esso. si prega di agitare bene prima dell'uso.
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You can follow below process to chontact us. All pictures are for illustration purpose only and Colours may vary slightly. Import Duties. avviso caldo:tenere i bambini lontano da esso. si prega di agitare bene prima dell'uso.
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Safe to use:With our safe,heatsink thermal paste,you ensure safe application with optimal heat dissipation.PC Thermal paste CPU is non-conductive and non-erosive. Before using thermal paste,make sure the surface of the processor is clean and dry.
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CORSAIR TM30’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer. Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste. Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
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Fits all A1181 from Late 2006 to Mid 2007. MacBook 13.3" 1.83GHz Core 2 Duo (A1181, MA699LL/A, MacBook2,1) - Late 2006. MacBook 13.3" 2.0GHz Core 2 Duo (A1181, MA700LL/A, MacBook2,1) - Late 2006. MacBook 13.3" 2.0GHz Core 2 Duo (A1181, MA701LL/A, MacBook2,1) - Late 2006.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
eBay