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The characteristics of PX806C ensure high performance and durability even in challenging conditions. PX806C also provides good impact strength, as well as improved stress relief and crack protection.
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So simple to mix-together, just open the bag then remove the central clip and mix. Thermal conductivity 0.45 W/mK. Viscosity 000 mPa/s at 25°C, 9.
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The epoxy resin, once applied, cured and hardened encases your electronics in a solid mass providing a barrier. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside.
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It is suitable for aesthetic as well as a protective application over the top of the luminaire. Due to the aliphatic chemical nature of the resin chemistry, the cured resin is naturally resistant to the yellowing effects of UV light.
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It has a low mixed viscosity and maintains excellent flexibility at low temperatures. 8800 is a cost-effective flexible potting option that provides exceptional physical protection and creates minimum stress on circuit boards and surface-mounted devices.
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