This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w.
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Heat sinko compound for use on PCBs for Transistors, Diodes, CPU's etc. Can be used beteen -50 DegreeC ~ 180 DegreeC 25 g compound injection type. Color:White Thermal Conductivity :>3.2Watt/m-k Thermal Impedance:<0.06 degree C-in2/Watt Operation Temperture:-50~180 C.
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Silicone Thermal Heatsink ComCooling Paste. This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. High thermal conductivity.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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This is achieved by creating an intimate bond between the surface of the device and the heat sink.
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TF9 1.5g-Ying-D5 Thermal Paste. Cleanup is also hassle-free.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Professional grade thermal paste. Ideal for 360's, Processors, Heat sinks CPU"s GPU"s and other component devices.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w.
eBay