1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
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Model: HY510. Features: 1. High Grade Stability And Reliability. Low Thermal Resistance And High Conductivity For Superior Heat Transfer. High Temperature Resistance. Specification: 1. Model: HY510 2.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor.
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It can improve the heat generated by the CPU or GPU is dissipated quickly and efficiently, and is even suitable for overclocking. After applying, you do not need to apply again because it will last at least 5 years.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Scope of application Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. The filling of the between the high-power transistor and the aluminum.
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Negligible electrical conductivity. Silvgrease1 was formulated to conduct heat, not electricity. Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
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