This SHUTTLE XPC GLAMOR PC is a powerful and reliable solution for your wafer processing needs. With a weight of 5.25 kg and a package weight of 9.75 kg, this barebone model is equipped with the necessary components to handle all your semiconductor and PCB manufacturing equipment. The S113G model features a high-quality power supply and is suitable for use in a variety of settings, including business, office, and industrial environments. It also comes with a packing charge of US$10, making it a great value for your money. Trust in the expertise of SHUTTLE and invest in this top-of-the-line PC for your wafer processing needs. It’s used so softener lol mint but works just fine
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Barebones Shuttle XPC SD32G2 (Intel Chipset) Comes with; Shuttle XPC Barebones system DVD-RW Drive 4GB of RAM
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SHUTTLE XPC SH97R6 Intel Core i5-4590 3.3 GHz / 8GB Ram / 4GB GPU FirePro 5100.
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The Shuttle XPC Case is a high-quality and compact desktop computer enclosure designed by the renowned brand Shuttle. This case is specifically designed to house and protect a PC desktop or all-in-one system, providing a secure and sleek design for your computer setup. With its durable construction and compact size, the Shuttle XPC Case is ideal for those looking to enhance the appearance and functionality of their desktop computer. Case in good condition hardly any marks with some sat cables fan and card reader
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Shuttle XPC Nano PC NC40U. The NC40U series provides an HDMI 2.0b, a DisplayPort 1.4a, and a Type-C to reach three independent displays, supporting resolutions up to 4096 x 2160 / 3840 x 2160 @60Hz.
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Shuttle XH110V Pentium G4400, 8GB Ram 256GB SSD. Complete with power lead. (2) set 4pin fan connectors. Power-On button. Support Wake-On-LAN function. Support Teaming function. (1) Clear CMOS button. BACK PANEL (2) RJ45 Gigabit LAN port.
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Product type: PC barebone. We add receipt to every product, if you would like to receive invoice - let us know and we will add invoice. Supported storage drive types: HDD & SSD. Storage drive interface: M.2, Serial ATA III.
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