Low thermal resistance and high thermal conductivity. Hot fat paste. Thermal conductivity : 1.93W /m-k. Thermal impedance :0.225. Material: silicone grease. All pictures are for illustration purpose only and Colours may vary slightly.
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Low thermal resistance and high thermal conductivity. Hot fat paste. Thermal conductivity : 1.93W /m-k. Thermal impedance :0.225. Material: silicone grease. Import Duties. Height: 3.5cm / 1.38in (approx.).
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Net Weight: 2x 1g. Quantity: 2x 1g. High thermal conductivity low bleed stable. Thermal coupling of electrical device to heatsinks. Paste Color: Silver. Thermal Conductivity:>1.22W/m. Thermal Resistance:<0.201°c-in2/w.
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Low thermal resistance and high thermal conductivity. Hot fat paste. Thermal conductivity : 1.93W /m-k. Thermal impedance :0.225. Material: silicone grease. All pictures are for illustration purpose only and Colours may vary slightly.
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Excellent thermal resistance (TR) and thermal conductivity (TC). X23-7868-2D,is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Stable homogeneous mixture for consistent thermal performance RoHS and REACH Compliant.
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Net Weight: 20g. Help disperse the heat from CPU to heatsink effectively. Suitable for: CPU heatsink or chip. High temperature resistance. Thermal Conductivity: >3.17W/m-k. Thermal Resistance: <0.067°C-in2/W.
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Low thermal resistance and high thermal conductivity. Hot fat paste. Thermal conductivity : 1.93W /m-k. Thermal impedance :0.225. Material: silicone grease. All pictures are for illustration purpose only and Colours may vary slightly.
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Material: Aluminum alloy. We want to make sure you are happy with our item. Goods without RMA number will NOT be accepted. We'd like to settle any problem in a friendly manner. 1x bracket.
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