Model: Thermal Conductive Adhesive. Thermal conductive adhesive content: 60g. 1 X Silicone Thermal Conductive Adhesive. Scope of application: The product can be filled in the seat of electronic devices (such as high-power diodes, transistors, traveling wave tube thyristors, etc.) and the assembly surface of radiator to reduce the working temperature of electronic devices and make them work stably.
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1 x Silicone Heatsink Plaster. Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. All pictures are for illustration purpose only and Colours may vary slightly.
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100x100mm Adhesive Conductive Heatsink Plaster Sheet Computer CPU Graphics Chip Cooling Silicone Grease Thermal Pad. 5pcs 1 X Conductive Heatsink Plaster. Size: 100 X 100mm/3.94 X 3.94" Thickness: 1.0mm/2.0mm (Optional) How to Use: 1.
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1 x Heatsink Plaster. Thermal resistance : <0.06 °C-in2/W. Thermal conductivity : >0.671 W/m-k. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
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1 x Silicone Heatsink Plaster. Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. All pictures are for illustration purpose only and Colours may vary slightly.
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High viscosity: high-quality tape, strong stickiness and ductility, no worries about the tape not being sticky. Features: Heat resistance: good thermal conductivity and heat dissipation, strong insulation and thermal conductivity, and a wide of suitable temperature.
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1 x Heatsink Plaster. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa. Thermal resistance : <0.06 °C-in2/W.
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Ceramic Heatsink is a passive heatsink for Raspberry Pi. Ceramic has high heat radiation efficiency than Copper/Aluminium. Includes thermal conductive adhesive backing tape. This heatsink can help reduce the risk of hardware failure due to overheating.
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