Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 5 × Thickness 0.5mm Silicone Thermal Pad.
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The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm.
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Honeywell PTM 7950 Laptop Thermal Paste Pad 80x80mm ONLY. PTM7950 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. PTM7950 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making the PTM7950 series desirable for high performance integrated circuit devices.
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The high performance thermal pad from Thermal Grizzly. Thermal Grizzly Minus Pad 8 High Performance Thermal Pad 120mm x 20mm x 1.5mm. Thermal Grizzly Minus Pad 8 High Performance Thermal Pad 120mm x 20mm x 3mm.
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Silicone Thermal Conductive Pad 67mm x 20mm x 0.5mm. 1 Piece Perfect size for M.2 SSD 2280 NVME These thermal conductive silicone pads are specially designed to transfer heat through the gap,effectively transferring the heat of the heat-generating component to the heat sink,and has thermal conduct electrical insulation properties,and the product is also has viscosity,and the application is safe and simple Easy Installation 1.Remove the old heat-conducting material,clean the surface 2.Determine the contact position,select the best matching thickness and cut the appropriate size 3.Tear off the protective films on both sizes 4.Exert certain pressure to make it with good contacts with both surfaces
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Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 5 × Thickness 0.5mm Silicone Thermal Pad.
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Gelid GP Ultimate Thermal Pads. Hardness (Shore): 60-70 OO. Thermal Conductivity (W/mK): 15. Ultimate Heat Conductivity, 15 W/mK. Size (mm): 90 x 50. This does not affect your statutory rights. We exclude any liability for any errors and omissions on the site.
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Fehonda Thermal Pad 85x45mm – Grey – Multiple Thicknesses – 12.8 W/m·K. Not ideal for hottest ICs like GDDR5/5X/6. 12.8W Fehonda – A capable all-rounder for most applications. Matches performance of Thermalright II and Gelid Ultimate.
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