100% New Heatsink thermal pads. Thermal Conductivity: 3.2w/m-K. 2 pcs 100mmx100mmx4mm thermal pads. Size:100mm 100mm 4mm(W L H).
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Thermal silica film is a high performance thermally conductive gap filling materials, mainly for passing interface electronics enclosure and heat sink or product between;. The thermal silica film has good adhesion, flexibility, good compression performance and excellent thermal conductivity;.
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And that's just one of the many benefits of these thermal pads. The features of the Thermal Grizzly Carbonaut Thermal Pad Thermal Grizzly Carbonaut: Powerful and Reusable. The material is subject to virtually no decomposition processes.
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Ultimate 15 W/mK heat conductivity. Thermal Conductivity 90mm x 50mm x 1mm. There is a separate area to leave a product review if you wish. We use a variety of different carriers to fulfil orders.
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The Thermal Pad based on silicone and special filler outperforms generic and performance pads by far. Thermal Pad. Efficient Thermal Conductivity. 5.0 cm (W) x 0.05 cm (D) x 5.0 cm (H) - Weight 0.6 kg.
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Gelid Solutions GP-Ultimate Thermal Pad 120 x 120 x 3mm 3 mm 15 W/mK RM-24Hr Del. Gelid Solutions GP-Ultimate Thermal Pad 120 x 120 x 2mm 2 mm 15 W/mK RM-24Hr Del. GP Thermal Pad 1.5mm. Thermal Conductivity (W/mK).
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Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. We will try our best to deal with the problem to make you satisfied. Hardness: 13C ~ 50C.
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Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. and best wishes!
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