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  1. 2x 4mm Silicone Pad Thermal Conductive Universal For Laptop Buffering CPU Cooler

    100% New Heatsink thermal pads. Thermal Conductivity: 3.2w/m-K. 2 pcs 100mmx100mmx4mm thermal pads. Size:100mm 100mm 4mm(W L H).

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  2. EKWB 0.5mm Thick Thermal pad B (75x50mm)

  3. 100X 10x10x0.5mm GPU CPU Thermal Conductive Silicone Pad Heatsink Cooling Chip !

    Heatsink Material:Silicone. Compatible CPU:CPU. Thermal Conductivity: 1.2W~2.0W. Silicone pad Size:10mm 10mm 1mm. and best wishes!

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  4. 1mm Thermal Pad 14.8 W/mK, 120x120x1mm, Non Conductive Heat Resistance High Temp

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  5. Thermal Conductive Blue Silicone Pad 0.5mm 1mm 1.5mm 2mm 2.5mm 3mm Thickness

    Material: Silicone. Product type based on your selection. Good Good quality.

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  6. Silicone Pad 100x100x2mm GPU CPU Heatsink Cooling Thermal Conductive Pad

    Thermal silica film is a high performance thermally conductive gap filling materials, mainly for passing interface electronics enclosure and heat sink or product between;. The thermal silica film has good adhesion, flexibility, good compression performance and excellent thermal conductivity;.

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  7. Voogenzek 600 PCS 10 X 10 Mm Silicone Thermal Pad, Thickness 0.5/1/1.5 Mm with 6

    Manufacturer VooGenzek. Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 200 × Thickness 0.5mm Silicone Thermal Pad.

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  8. Thermal Grizzly Minus Pad 8 High Performance Thermal Pad 30mm x 30mm x 1.5mm

    The high performance thermal pad from Thermal Grizzly. - High thermal conductivity. MINUS PAD 8 - 30X 30X 1.5 MM. Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transfer.

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  9. 5 Pcs Silicone Thermal Conductivity Pad CPU GPU Heat Conduction Sheet UK

    The pad has viscosity, simple and convenient application, stable heat conduction, insulation and softness and flexibility. Good thermal conductivity, insulation, viscosity, elasticity, low heat resistance, filling.

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