Height Off Base (Height of Fin): 1.500 (38.10mm). Material: Aluminum. Material Finish: Black Anodized. Thermal Resistance @ Natural: 6.30°C/W. Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM.
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Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 400 LFM. Power Dissipation @ Temperature Rise: 1.0W @ 30°C. Thermal Resistance @ Natural: 27.30°C/W. Type: Board Level. Material: Aluminum. Shape: Rectangular Fins.
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Specifications: Description: 21x15x10mm Aluminum Heat Sink for TO-220 Mosfet Transistors, Power IC.
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Height Off Base (Height of Fin): 1.750" (44.45mm). Power Dissipation @ Temperature Rise: 4.0W @ 30°C. Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 400 LFM. Shape: Square, Fins. Part Status: Active.
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A high power extruded bolt-on heat sink with large radial fins and straight pins. Suitable for use with TO-218 and TO-220 type components. Thermal resistance 4.4°C/W Vertical mounting Black anodised finish Dimensions 38.1 x 41.91 x 25.4mm .
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A high power extruded bolt-on heat sink with large radial fins and solderable shoulder pins. Suitable for use with TO-218, TO-220 or TO-247 type components. Thermal resistance 3.3°C/W Vertical mounting Black anodised finish Dimensions 50.8 x 41.91 x 25.4mm .
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▪️ Crafted from pure aluminium alloy, employing both hot and cold processing techniques during manufacture. Features high-temperature resistance, extensive surface area for heat dissipation, excellent thermal conductivity, accelerated heat transfer, and natural cooling.
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Specifications:Description:21x15x10mm Aluminum Heat Sink for TO-220 Mosfet Transistors, Power IC.
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