This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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The Halnziye HY510 Thermal Paste Syringe is a high-quality thermal compound designed for use with CPUs and heatsinks. HIGH CONDUCTIVITY OF HEAT 25 grams per syringe! With a grey colour this product is ideal for efficiently transferring heat and cooling systems. suitable for CPU, VGA, LED, CHIPSET AND OTHER PC COMPONENTS! As a UK seller, customers can trust the authenticity and reliability of this product for their computer heat conduction needs.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w. Paste Colour: Grey. Dielectric Breakdown: 5.0 KV ac.
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Manufacturer: SYY. EASY TO APPLY SYY thermal paste has ideal consistency, not electrically conductive and noncorroding thermal grease, safe to use with all types of heatsinks and is very easy to use even for beginners.
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This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dissipation of your processor. Thermal conductivity: 5.15 W/m-k. Thermal resistance: 0.004 C-in2/w.
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Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dissipation of your processor. This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
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