This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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Heat sinko compound for use on PCBs for Transistors, Diodes, CPU's etc. Can be used beteen -50 DegreeC ~ 180 DegreeC 25 g compound injection type. Color:White Thermal Conductivity :>3.2Watt/m-k Thermal Impedance:<0.06 degree C-in2/Watt Operation Temperture:-50~180 C.
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Kafuter 80g k-5204k LED thermal conductive silicone CPU bonding adhesive quick-drying thermal silica curable coefficient 1.6 white. 3, will be glued or sealed parts in the air, let it cure. K-5204K both silicone thermal plastic bonding effect, and good thermal conductivity (heat dissipation) properties.
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Manufacturer: SYY. EASY TO APPLY SYY thermal paste has ideal consistency, not electrically conductive and noncorroding thermal grease, safe to use with all types of heatsinks and is very easy to use even for beginners.
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Core i5-760 with sSpec SLBRP. This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dissipation of your processor. Suitable for the following Processors.
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Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. This thermal grease can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dissipation of your processor. This thermal transfer compound improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. Paste Colour: Grey. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w.
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