1 x Heatsink Plaster. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa. Thermal conductivity : >0.671 W/m-k.
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Thermal conductive performance high and stable, its life is longer than the general thermal double-sided stickers, can work under normal temperature (80-120°C) minimum 5 years. For CPU, LED,PPR heat sink, microprocessor.
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Thermal conductive performance high and stable, its life is longer than the general thermal double-sided stickersHigh Insulation and Low Hardness. Thermal Conductivity: 1.2W/m-k. Type:Multi Width Transfer Tape.
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Model: Thermal Conductive Adhesive. Thermal conductive adhesive content: 60g. 1 X Silicone Thermal Conductive Adhesive. Scope of application: The product can be filled in the seat of electronic devices (such as high-power diodes, transistors, traveling wave tube thyristors, etc.) and the assembly surface of radiator to reduce the working temperature of electronic devices and make them work stably.
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Note: Please clean and keep dry of chip's surface before installing. Feature:Aluminum heatsink can be applied to devices to cool stepper motor and 3D printers.Pre-applied heat conductive adhesive tape for optimum heat transfer and easy installation.Specification:Material: Aluminum AlloyOverall Size: 9 x 9 x 12 mm / 0.35 x 0.35 x 0.47 inch (L*W*H).
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Pure copper (401W/mk) has a higher thermal conductivity than pure aluminum (237W/mk). Pattern: Grid. Material: Pure Copper. Colour: Brown. Before installing, remove the blue sticker & the RAM specification label.
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Material: Rubber Sealant. After general cleaning and drying, the glue is extruded from the hose, directly coated and bonded, and placed at room temperature for 12-24 hours. It absorbs trace water vapor in the air and solidifies itself.
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Model: Thermal Conductive Adhesive. Thermal conductive adhesive content: 60g. 1 X Silicone Thermal Conductive Adhesive. Scope of application: The product can be filled in the seat of electronic devices (such as high-power diodes, transistors, traveling wave tube thyristors, etc.) and the assembly surface of radiator to reduce the working temperature of electronic devices and make them work stably.
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