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  1. Silicone Thermal Conductive High Temperature Resistant Rubber Adhesive Sealant

    Material: Rubber Sealant. After general cleaning and drying, the glue is extruded from the hose, directly coated and bonded, and placed at room temperature for 12-24 hours. It absorbs trace water vapor in the air and solidifies itself.

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  2. Adhesive Conductive Heatsink Sheet CPU Graphics Grease Thermal Pad (2.0mm)

    100x100mm Adhesive Conductive Heatsink Plaster Sheet Computer CPU Graphics Chip Cooling Silicone Grease Thermal Pad. 3pcs 1 X Conductive Heatsink Plaster. Size: 100 X 100mm/3.94 X 3.94" Thickness: 1.0mm/2.0mm (Optional) How to Use: 1.

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  3. Heat Sink Thermal Grease STARS-922 Heatsink Plaster Thermal Conductive Adhesive

    1 x Heatsink Plaster. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa. Thermal conductivity : >0.671 W/m-k.

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  4. Thermal Conductive Adhesive Glue Paste for Chip VGA RAM Computer CPU Radiation

    Model: Thermal Conductive Adhesive. Thermal conductive adhesive content: 60g. 1 X Silicone Thermal Conductive Adhesive. Scope of application: The product can be filled in the seat of electronic devices (such as high-power diodes, transistors, traveling wave tube thyristors, etc.) and the assembly surface of radiator to reduce the working temperature of electronic devices and make them work stably.

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  5. 10g Silicone Thermal Conductive Adhesive Glue Tube Heatsink-Plaster No F7N9

    1 x Silicone Heatsink Plaster. Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. All pictures are for illustration purpose only and Colours may vary slightly.

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  6. Copper Heatsink Grid Thermal Conductive Adhesive IC CPU RAM Chip Dissipate Heat

    Material Characteristics: High thermal conductivity, fast and efficient heat conduction, and good ductility, corrosion resistance. Application Scenarios: Mainly used for electronic chip heat dissipation.

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  7. Silicone Thermal Conductive Adhesive Plaster Viscous Glue for Chip VGA RAM

    Model: Thermal Conductive Adhesive. Thermal conductive adhesive content: 60g. 1 X Silicone Thermal Conductive Adhesive. Scope of application: The product can be filled in the seat of electronic devices (such as high-power diodes, transistors, traveling wave tube thyristors, etc.) and the assembly surface of radiator to reduce the working temperature of electronic devices and make them work stably.

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  8. 10g HC-910 Silicone Thermal Conductive Adhesive Plaster Heatsink Glue X5K2

    1 x Silicone Heatsink Plaster. Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. All pictures are for illustration purpose only and Colours may vary slightly.

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