It has the characteristics of high thermal conductivity and insulation, and has softness, compressibility, fit and strong viscosity. It is suitable for a wide temperature range, can fill the uneven surface, can closely and firmly fit the heat source device and heat sink, and quickly conduct the heat out.
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Pure copper (401W/mk) has a higher thermal conductivity than pure aluminum (237W/mk). Before installing, remove the blue sticker & the SSD specification label. Thickness: 2mm. Material: Copper. Size: 48mm x 18mm.
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Ceramic Heatsink is a passive heatsink for Raspberry Pi. Ceramic has high heat radiation efficiency than Copper/Aluminium. Includes thermal conductive adhesive backing tape. This heatsink can help reduce the risk of hardware failure due to overheating.
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Ceramic Heatsink is a passive heatsink for Raspberry Pi. Ceramic has high heat radiation efficiency than Copper/Aluminium. Includes thermal conductive adhesive backing tape. This heatsink can help reduce the risk of hardware failure due to overheating.
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Solder Seal Sleeve. North and South Bridge etc. Thermal conductivity: >0.671W/m. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.
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8329TCS - Thermal Adhesive, High TC (8329TCS-6ML). It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available.
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Pure copper (401W/mk) has a higher thermal conductivity than pure aluminum (237W/mk). This heatsink can help reduce temperatures from 5°C - 20°C. Before installing, remove the blue sticker & the SSD specification label.
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🔘Material: Silicone. Information Links.
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