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  1. Copper mSATA SSD Heatsink Grid Thermal Conductive Adhesive 5030 SATA 40x26mm

    MSATA Heatsink is a passive heatsink for mSATA 5030 drives. Pure copper (401W/mk) has a higher thermal conductivity than pure aluminum (237W/mk). This heatsink can help reduce temperatures from 5°C - 20°C.

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  2. 5g Thermal Grease Paste Conductive Heatsink Plaster Adhesive Glue For Chip VGA

    Specifications: 5g (single). Thermal properties, strong glue adhesion. Thermal Conductivity: >0.671W/m-K. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.

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  3. Uxcell Heatsink with Thermal Conductive Adhesive Tape 9 x 9 x 12mm Blue 20pcs

    Brand sourcing map Cooler heat sink material Aluminium Cooler heatsink compatibility Aluminium Mounting type Adhesive Manufacturer sourcing map [PARAMETER] Overall Size: 9 x 9 x 12 mm / 0.35 x 0.35 x 0.47 inch (L*W*H); Color:Blue. [APPLICATION] Great for cooling chips, stepper motor driver module and other small electronics that didn't come with any cooling. [INSTRUCTION] The heatsink themselves won't cool anything down, they need air flow.We recommend using them together with cooling fan(here is not included). [PASTEABILITY] Pre-applied heat conductive adhesive tape for optimum heat transfer and easy installation. [NOTE] Please clean and keep dry of the surface before installing.

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  4. Dowsil Q1-9226 Thermally Conductive Adhesive Kit

    Dowsil Q1-9226 facilitates optimal heat dissipation, ensuring the longevity and efficiency of electronic components. The adhesive is self priming, semi-flowable, and has a long pot life, simplifying the application process for users.

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  5. 8329TFF-25ML Fast Cure Thermally Conductive Adhesive, Flowable

    8329TFF - Fast Cure Thermal Adhesive. This product is viscous, yet flowable enough to be dispensed from a syringe. The 50ml size may be used with a mixing tip when dispensing with a caulking gun or pressurized system.

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  6. MG Chemicals Thermal Conductive Epoxy Adhesive Slow Cure 8329TCS-6ML

    8329TCS - Thermal Adhesive, High TC (8329TCS-6ML). It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available.

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  7. Highly Conductive 10G HC910 Silicone Heat Adhesive for Hot Thermal Lot J5

    Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. 1 x Silicone Heatsink Plaster.

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  8. Highly Conductive 10G HC910 Silicone Heat Adhesive for Hot Thermal New Y2

    Capacity: 10g. Despite it being an adhesive, removal is as easy as a thermal pad, without leaving residue behind. 1 x Silicone Heatsink Plaster.

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